Test Spectrum is committed to offering the latest technologies in PCB fabrication and assembly. Some of our current PCB fabrication capabilities include:

  • Up to 50 layers
  • Down to .0013” line & spacing
  • PCB’s up to .350” thick
  • Plating aspect ratios up to 32:1
  • .004” mechanical drilling
  • .0012” laser microvias
  • .0059” flip drilling up to .187” thick
  • .0051” flip drilling up to .150” thick
  • .002”/inch flatness tolerance
  • 100% opens/shorts electrical test

In addition to PCB fabrication, Test Spectrum also has in‐house PCB assembly capability.

  • In‐house Assemblers
  • Component Procurement
  • Surface Mount and thru‐hole assembly
  • Lead Free & High Temp solder options
  • Reflow and IR capability
  • X‐Ray inspection & verification
  • Stencil Creation
  • Stiffeners for all major ATE
  • Probe Needle Ring Assembly